For the Inventor, By the Inventor

Enter inventor name

Hsinchu, Taiwan

Tien-Chang Chang

USPTO Granted Patents = 14 (Patent Applications = 4)

Average Co-Inventor Count = 3.1

ph-index = 6

Forward Citations = 66(Granted Patents)

Company Filing History:

14 out of 4,763

Mediatek Corporation

Years Active: 2010-2023

Loading Chart...

14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11854924 - Semiconductor package with improved reliability (2023-12-26),

2. 9847294 - Semiconductor device allowing metal layer routing formed directly under metal pad (2017-12-19),

3. 9627336 - Semiconductor device allowing metal layer routing formed directly under metal pad (2017-04-18),

4. 9455226 - Semiconductor device allowing metal layer routing formed directly under metal pad (2016-09-27),

5. 8766417 - Integrated circuit chip with reduced IR drop (2014-07-01),

6. 8669619 - Semiconductor structure with multi-layer contact etch stop layer structure (2014-03-11),

7. 8587090 - Die seal ring structure (2013-11-19),

8. 8476745 - Integrated circuit chip with reduced IR drop (2013-07-02),

9. 8242586 - Integrated circuit chip with seal ring structure (2012-08-14),

10. 8212323 - Seal ring structure for integrated circuits (2012-07-03),

11. 8188578 - Seal ring structure for integrated circuits (2012-05-29),

12. 8138616 - Bond pad structure (2012-03-20),

13. 7671469 - SiGe device with SiGe-embedded dummy pattern for alleviating micro-loading effect (2010-03-02),

14. 7667302 - Integrated circuit chip with seal ring structure (2010-02-23),

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

Loading…