Tien-Chang Chang

Title: Tien-Chang Chang: Innovator in Semiconductor Technology

Introduction

Tien-Chang Chang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 14 patents. His work focuses on improving the reliability and efficiency of semiconductor devices.

Latest Patents

Among his latest patents, Tien-Chang Chang has developed a semiconductor package with improved reliability. This innovative semiconductor device includes a semiconductor die with an active surface, an opposite surface, and a vertical sidewall. It features input/output (I/O) connections on the active surface and a redistribution layer (RDL) on the active surface of the semiconductor die. The device is encapsulated with a molding compound that covers the opposite surface and vertical sidewall, enhancing its durability. Another notable patent involves a semiconductor device that allows metal layer routing formed directly under a metal pad. This design includes a metal pad positioned on a first metal layer, with a specific metal layer routing formed in a second metal layer directly beneath it, separated by an oxide layer.

Career Highlights

Tien-Chang Chang is currently employed at MediaTek Corporation, a leading company in the semiconductor industry. His work at MediaTek has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the field.

Collaborations

Throughout his career, Tien-Chang Chang has collaborated with notable colleagues, including Tao Cheng and Tung-Hsing Lee. These collaborations have fostered innovation and have been instrumental in the development of cutting-edge semiconductor technologies.

Conclusion

Tien-Chang Chang's contributions to semiconductor technology are noteworthy, with a focus on enhancing device reliability and efficiency. His innovative patents and collaborations reflect his commitment to advancing the field.