The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Jul. 07, 2008
Applicants:
Tien-chang Chang, Hsinchu, TW;
Tao Cheng, Hsinchu, TW;
Chien-hui Chuang, Taipei County, TW;
Bo-shih Huang, Kaohsiung, TW;
Inventors:
Tien-Chang Chang, Hsinchu, TW;
Tao Cheng, Hsinchu, TW;
Chien-Hui Chuang, Taipei County, TW;
Bo-Shih Huang, Kaohsiung, TW;
Assignee:
Mediatek Inc., Science-Based Industrial Park, Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A bond pad structure of an integrated circuit includes a conductive pad disposed on a first dielectric layer, a first conductive block formed in a second dielectric layer below the first dielectric layer and electrically connected to the conductive pad through a first via plug formed in the first dielectric layer, and an electrically floating first conductive plate situated under the conductive pad.