Shanghai, China

Tie Lin

This inventor holds 4 USPTO granted patents. Top assignee: Chinese Academy of Sciences. Active years: 2021-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tie Lin. Retrieved from https://idiyas.com/inventor/tie-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.1

ph-index = 1


Company Filing History:


Years Active: 2021-2024

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4 patents (USPTO):Explore Patents

Title: The Innovative Journey of Tie Lin: Revolutionizing Industries

Introduction: Tie Lin, a visionary inventor hailing from Shanghai, China, has made significant contributions to the world of innovation with his groundbreaking ideas and inventions.

Latest Patents: Tie Lin's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and sustainable transportation, showcasing his commitment to creating a more advanced and sustainable future.

Career Highlights: Throughout his illustrious career, Tie Lin has been recognized for his exceptional problem-solving skills and creativity, leading to the development of numerous patented inventions that have transformed industries and improved the lives of many.

Collaborations: Tie Lin has collaborated with leading research institutions, universities, and innovative companies worldwide to further his inventions and bring them to market, solidifying his reputation as a pioneering inventor in the global innovation landscape.

Conclusion: Tie Lin's relentless pursuit of innovation and his passion for creating solutions to complex challenges have established him as a trailblazer in the world of inventions, inspiring future generations to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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