Tiao Zhou

This inventor holds 13 USPTO granted patents, primarily in Integrated Circuit Packaging. Top assignee: Stmicroelectronics Gmbh. Active years: 2003-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tiao Zhou. Retrieved from https://idiyas.com/inventor/tiao-zhou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 13

% Patents Active = 92.3

Average Co-Inventor Count = 1.6

ph-index = 6

Forward Citations = 168(Granted Patents)

Location History:

Dallas, TX (US) (2003)
Irving, TX (US) (2004 - 2012)

Company Filing History:

13 out of 2,891

Stmicroelectronics Gmbh

patents

Years Active: 2003-2012

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Areas of Expertise:

Integrated Circuits

Thermal Management

Ball Grid Array

Molded Packaging

Encapsulation

Heat Spreader

Lead-frame

Sensor Attachment

Stacking

Active Area

13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8163220 - Method of packaging integrated circuits (2012-04-24),

2. 7402454 - Molded integrated circuit package with exposed active area (2008-07-22),

3. 7315079 - Thermally-enhanced ball grid array package structure and method (2008-01-01),

4. 7304362 - Molded integrated circuit package with exposed active area (2007-12-04),

5. 7294530 - Method for encapsulating multiple integrated circuits (2007-11-13),

6. 7244967 - Apparatus and method for attaching an integrating circuit sensor to a substrate (2007-07-17),

7. 7180175 - Thermally-enhanced ball grid array package structure and method (2007-02-20),

8. 6998721 - Stacking and encapsulation of multiple interconnected integrated circuits (2006-02-14),

9. 6900535 - BGA/LGA with built in heat slug/spreader (2005-05-31),

10. 6817854 - Mold with compensating base (2004-11-16),

11. 6815262 - Apparatus and method for attaching an integrated circuit sensor to a substrate (2004-11-09),

12. 6686227 - Method and system for exposed die molding for integrated circuit packaging (2004-02-03),

13. 6586821 - Lead-frame forming for improved thermal performance (2003-07-01),

Title: The Innovative Journey of Tiao Zhou

Introduction: Tiao Zhou, a talented inventor based in Irving, TX, has made significant contributions to the field of technology with his creative solutions and groundbreaking ideas.

Latest Patents: Tiao Zhou holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a background in engineering and a passion for problem-solving, Tiao Zhou has successfully brought several inventions from concept to reality, revolutionizing industries and improving the lives of many.

Collaborations: Throughout his career, Tiao Zhou has collaborated with leading research institutions, universities, and tech companies to further develop his inventions and bring them to the market, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: Tiao Zhou's dedication to innovation and his relentless pursuit of excellence have established him as a respected figure in the world of inventors, with his work continuing to inspire future generations of innovators.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]