The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Jul. 13, 2004
Michael J. Hundt, Double Oak, TX (US);
Tiao Zhou, Irving, TX (US);
Michael J. Hundt, Double Oak, TX (US);
Tiao Zhou, Irving, TX (US);
STMicroelectronics, Inc., Carrollton, TX (US);
Abstract
A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface that contacts a mounting surface of the first mold block; 2) placing an adhesive on the first substrate surface; 3) placing an integrated circuit sensor on the adhesive; and 4) pressing a second mold block against the first substrate surface. The second mold block comprising a cavity portion for receiving the integrated circuit sensor, a contact surface surrounding the cavity portion, and a compliant layer mounted with the cavity portion. Pressing the second mold block against the first substrate surface causes the contact surface to form with the first substrate surface a seal surrounding the integrated circuit sensor. Pressing also causes the compliant layer to press against a sensor array surface of the integrated circuit sensor, thereby pressing the integrated circuit sensor into the adhesive and the first substrate surface.