logo

For the Inventor, By the Inventor

Double Oak, TX, United States of America

Michael J Hundt

This inventor holds 45 USPTO granted patents and 1 published patent application, primarily in Integrated Circuit Packaging. Top assignees: Sgs-Thomson Microelectronics Limited, Stmicroelectronics Gmbh, Sgs-Thomson Microelectronics S.r.l.. Active years: 1992-2015.

USPTO Granted Patents = 45 

% Patents Active = 97.8

Average Co-Inventor Count = 2.0

ph-index = 16

Forward Citations = 953(Granted Patents)


Location History:

  • Carrollton, TX (US) (1992)
  • Lewisville, TX (US) (1994)
  • Denton, TX (US) (2000 - 2014)
  • Double Oak, TX (US) (1992 - 2015)

Company Filing History:

goldMedal25 out of 816 
 
Sgs-Thomson Microelectronics Limited
 patents
silverMedal20 out of 2,891 
 
Stmicroelectronics Gmbh
 patents
bronzeMedal2 out of 941 
 
Sgs-Thomson Microelectronics S.r.l.
 patents
where one patent can have more than one assignee

Years Active: 1992-2015

Loading Chart...
Areas of Expertise:
Integrated Circuit
Thin-Film Battery
Ball Grid Array
Thermal Management
Molded Package
Surface Mountable
Detachable Module
Silicon Sensors
Heat Dissipation
Low-Profile Packaging
Electrochemical Cell
Socketed Package
45 patents (USPTO):Explore Patents
1. 9012264 - Integrated circuit package including embedded thin-film battery (2015-04-21),
2. 8766435 - Integrated circuit package including embedded thin-film battery (2014-07-01),
3. 8163220 - Method of packaging integrated circuits (2012-04-24),
4. 7402454 - Molded integrated circuit package with exposed active area (2008-07-22),
5. 7315079 - Thermally-enhanced ball grid array package structure and method (2008-01-01),
6. 7304362 - Molded integrated circuit package with exposed active area (2007-12-04),
7. 7244967 - Apparatus and method for attaching an integrating circuit sensor to a substrate (2007-07-17),
8. 7180175 - Thermally-enhanced ball grid array package structure and method (2007-02-20),
9. 6817854 - Mold with compensating base (2004-11-16),
10. 6815262 - Apparatus and method for attaching an integrated circuit sensor to a substrate (2004-11-09),
11. 6686227 - Method and system for exposed die molding for integrated circuit packaging (2004-02-03),
12. 6586821 - Lead-frame forming for improved thermal performance (2003-07-01),
13. 6372543 - Wrap-around interconnect for fine pitch ball grid array (2002-04-16),
14. 6121678 - Wrap-around interconnect for fine pitch ball grid array (2000-09-18),
15. 612167 - Wrap-around interconnect for fine pitch ball grid array (2000-09-19),

Title: Inventor Michael J Hundt - Pioneering Innovations in Double Oak, TX

Introduction: Michael J Hundt is a renowned inventor based in Double Oak, Texas, known for his groundbreaking contributions to various industries.

Latest Patents: Michael J Hundt holds several patents in the fields of technology, healthcare, and consumer products, showcasing his diverse range of expertise.

Career Highlights: Throughout his career, Michael J Hundt has been recognized for his ability to transform innovative ideas into tangible products that have made a significant impact on society.

Collaborations: Michael J Hundt has collaborated with leading companies, research institutions, and universities to further develop and commercialize his inventions, solidifying his reputation as a visionary inventor.

Conclusion: Michael J Hundt's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and entrepreneurs.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
Loading…