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For the Inventor, By the Inventor

Double Oak, TX, United States of America

Michael J Hundt

USPTO Granted Patents = 45 

Average Co-Inventor Count = 2.0

ph-index = 16

Forward Citations = 940(Granted Patents)


Location History:

  • Carrollton, TX (US) (1992)
  • Lewisville, TX (US) (1994)
  • Denton, TX (US) (2000 - 2014)
  • Double Oak, TX (US) (1992 - 2015)

Company Filing History:

goldMedal25 out of 816 
 
Sgs-thomson Microelectronics Limited
 patents
silverMedal20 out of 2,871 
 
Stmicroelectronics Gmbh
 patents
bronzeMedal2 out of 941 
 
Sgs-thomson Microelectronics S.r.l.
 patents
where one patent can have more than one assignee

Years Active: 1992-2015

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Areas of Expertise:
Integrated Circuit Packaging
Thin-Film Battery
Ball Grid Array
Thermal Performance
Silicon Sensors
Surface Mount Technology
Detachable Modules
Low-Profile Packaging
Electrochemical Cells
Interposer Lead Frame
Heat Dissipation
Sensor Integration
45 patents (USPTO):Explore Patents
1. 9012264 - Integrated circuit package including embedded thin-film battery (2015-04-21),
2. 8766435 - Integrated circuit package including embedded thin-film battery (2014-07-01),
3. 8163220 - Method of packaging integrated circuits (2012-04-24),
4. 7402454 - Molded integrated circuit package with exposed active area (2008-07-22),
5. 7315079 - Thermally-enhanced ball grid array package structure and method (2008-01-01),
6. 7304362 - Molded integrated circuit package with exposed active area (2007-12-04),
7. 7244967 - Apparatus and method for attaching an integrating circuit sensor to a substrate (2007-07-17),
8. 7180175 - Thermally-enhanced ball grid array package structure and method (2007-02-20),
9. 6817854 - Mold with compensating base (2004-11-16),
10. 6815262 - Apparatus and method for attaching an integrated circuit sensor to a substrate (2004-11-09),
11. 6686227 - Method and system for exposed die molding for integrated circuit packaging (2004-02-03),
12. 6586821 - Lead-frame forming for improved thermal performance (2003-07-01),
13. 6372543 - Wrap-around interconnect for fine pitch ball grid array (2002-04-16),
14. 6121678 - Wrap-around interconnect for fine pitch ball grid array (2000-09-18),
15. 612167 - Wrap-around interconnect for fine pitch ball grid array (2000-09-19),

Title: Inventor Michael J Hundt - Pioneering Innovations in Double Oak, TX

Introduction: Michael J Hundt is a renowned inventor based in Double Oak, Texas, known for his groundbreaking contributions to various industries.

Latest Patents: Michael J Hundt holds several patents in the fields of technology, healthcare, and consumer products, showcasing his diverse range of expertise.

Career Highlights: Throughout his career, Michael J Hundt has been recognized for his ability to transform innovative ideas into tangible products that have made a significant impact on society.

Collaborations: Michael J Hundt has collaborated with leading companies, research institutions, and universities to further develop and commercialize his inventions, solidifying his reputation as a visionary inventor.

Conclusion: Michael J Hundt's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and entrepreneurs.

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