The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2015
Filed:
Jul. 01, 2014
Applicant:
Stmicroelectronics, Inc., Coppell, TX (US);
Inventors:
Michael J. Hundt, Double Oak, TX (US);
Haibin Du, The Colony, TX (US);
Krishnan Kelappan, Carrollton, TX (US);
Frank Sigmund, Coppell, TX (US);
Assignee:
STMicroelectronics, Inc., Coppell, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/02 (2006.01); G06K 19/077 (2006.01); H01M 2/10 (2006.01); G21H 1/06 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
G21H 1/06 (2013.01); H01L 23/49575 (2013.01); H01L 23/49593 (2013.01); H01L 24/32 (2013.01); H01L 21/561 (2013.01); H01L 24/28 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/01003 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/14 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01087 (2013.01); H01L 2924/10253 (2013.01); Y10S 257/924 (2013.01);
Abstract
An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.