The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2005
Filed:
May. 01, 2002
Applicant:
Tiao Zhou, Irving, TX (US);
Inventor:
Tiao Zhou, Irving, TX (US);
Assignee:
STMicroelectronics, Inc., Carrollton, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/36 ; H01L021/48 ; H05K001/00 ;
U.S. Cl.
CPC ...
Abstract
A ball or land grid array plastic substrate portion is formed with a hole therethrough in the region on which the integrated circuit die is to be formed, with a copper heat slug inserted within the opening having a bottom surface substantially aligned with the bottom surface of the plastic portion to allow molding tooling for conventional ball or land grid array packages to be employed. The integrated circuit die is mounted on the heat slug, which has a solderable bottom surface and is directly soldered to the PCB. An additional copper heat spreader region is formed on an upper surface of the plastic portion.