Tian Zeng

Title: Innovations of Tian Zeng in Semiconductor Technology

Introduction

Tian Zeng is a prominent inventor based in Hubei, China. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on improving manufacturing processes and enhancing the performance of semiconductor devices.

Latest Patents

One of Tian Zeng's latest patents is related to a metal lead and semiconductor device, along with methods of fabricating the same. This invention discloses a process where a first trench is formed simultaneously with a wiring layer trench. Following this, a second trench is created in communication with the first trench. A conductive structure is then formed by filling a conductive material in the first, second, and wiring layer trenches simultaneously. This innovative approach eliminates the need for additional openings and reduces the necessity of etching a deposited aluminum layer, ultimately saving on production costs by minimizing the use of two photomasks.

Another notable patent is a method for manufacturing a bonding structure. This method involves edge trimming from the bonding surface of an n-th wafer when bonding it with an (n-1)th wafer. The width of the first edge trimming is gradually increased as n increases. This process allows for the removal of uneven portions at the edge of the n-th wafer, improving the bonding strength and reducing the risk of cracking between the wafers.

Career Highlights

Tian Zeng is currently employed at Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. His role in the company has been pivotal in advancing semiconductor manufacturing techniques. His innovative approaches have not only contributed to the company's success but have also set new standards in the industry.

Collaborations

Tian Zeng collaborates with several talented individuals in his field, including Changlin Zhao and Xing Hu. Their combined expertise fosters a creative environment that drives innovation and enhances the development of new technologies.

Conclusion

Tian Zeng's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a leading inventor in the industry. His innovative methods are paving the way for advancements in semiconductor manufacturing, showcasing the importance of creativity and collaboration in technological progress.