The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Sep. 25, 2019
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., Hubei, CN;
Tian Zeng, Hubei, CN;
Abstract
A bonding structure and a method for manufacturing the same. First edge trimming is performed from the bonding surface of an n-th wafer in bonding the n-th wafer and an (n−1)th wafer, and a width of the first edge trimming is W. As n increases, the width of the first edge trimming is gradually increased. In the trimming, a portion that is not even at the edge of the n-th wafer can be removed. The bonding surface of the n-th wafer faces the bonding surface of the (n−1)-th wafer, so as to bond the n-th wafer and the (n−1)-th wafer. Afterwards the substrate of the n-th wafer is thinned, so as to form the (n−1)-th wafer stack. There is a reduced possibility that a gap exists between the bonding interfaces of the wafers, a bonding strength between the wafers is improved, and a risk of cracking is reduced.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile