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For the Inventor, By the Inventor

St. Louis Park, MN, United States of America

Thomas J Dunaway

USPTO Granted Patents = 24

 

Average Co-Inventor Count = 2.7

ph-index = 13

Forward Citations = 441(Granted Patents)


Location History:

  • Minneapolis, MN (US) (1985)
  • St Louis Park, MN (US) (1991)
  • St. Louis Park, MN (US) (1990 - 1992)
  • New Hope, MN (US) (1996 - 2003)

Company Filing History:

goldMedal23 out of 3,645 
 
Honeywell G.m.b.h.
 patents
silverMedal1 out of 1,468 
 
Atmel Corporation
 patents

Years Active: 1985-2003

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24 patents (USPTO):Explore Patents
1. 6611054 - IC package lid for dose enhancement protection (2003-08-26),
2. 5891745 - Test and tear-away bond pad design (1999-04-06),
3. 5874319 - Vacuum die bond for known good die assembly (1999-02-23),
4. 5773311 - Method for providing a test connection and a permanent connection site (1998-06-30),
5. 5719748 - Semiconductor package with a bridge for chip area connection (1998-02-17),
6. 5498900 - Semiconductor package with weldable ceramic lid (1996-03-12),
7. 5161729 - Package to semiconductor chip active interconnect site method (1992-11-10),
8. 5140496 - Direct microcircuit decoupling (1992-08-18),
9. 5139610 - Method of making a surface etched shadow mask (1992-08-18),
10. 5101550 - Removable drop-through die bond frame (1992-04-07),
11. 5099306 - Stacked tab leadframe assembly (1992-03-24),
12. 5074036 - Method of die bonding semiconductor chip by using removable frame (1991-12-24),
13. 5066831 - Universal semiconductor chip package (1991-11-19),
14. 5066614 - Method of manufacturing a leadframe having conductive elements preformed (1991-11-19),
15. 5036163 - Universal semiconductor chip package (1991-07-30),

Title: The Innovative Mind of Thomas J Dunaway

Introduction:

Thomas J Dunaway is a prolific inventor based in St. Louis Park, MN, USA, with a remarkable track record in the field of innovations. With an impressive 24 patents to his name, Dunaway's contributions have significantly impacted various industries.

Latest Patents:

One of Dunaway's latest patents is the 'IC package lid for dose enhancement protection', which involves an integrated circuit package designed for use in radiation environments. This package includes a base for housing an integrated circuit die, with a lid featuring a cladding of low atomic number material to mitigate electron emission from absorbed radiation. Another noteworthy patent is the 'Test and tear-away bond pad design', a unique approach to bond pad arrangement for thermocompression wire bonding, streamlining the production assembly process.

Career Highlights:

Dunaway has been associated with prominent companies like Honeywell G.m.b.h. and Atmel Corporation, where his innovative mindset and dedication to progress have shone through. His work reflects a deep understanding of technological advancements and a commitment to pushing boundaries in the industry.

Collaborations:

Throughout his career, Dunaway has collaborated with esteemed professionals such as Richard K Spielberger and Lori A Dicks, fostering a culture of innovation and excellence. These partnerships have led to the development of groundbreaking inventions and patents, showcasing Dunaway's ability to thrive in collaborative environments.

Conclusion:

In conclusion, Thomas J Dunaway's journey as an inventor exemplifies the power of innovation and perseverance in driving technological advancements. His legacy of patents and collaborations underscores his invaluable contributions to the realm of inventions, laying a strong foundation for future innovations in the industry.

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