The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 1999
Filed:
Oct. 07, 1997
Applicant:
Inventors:
Thomas J Dunaway, New Hope, MN (US);
Richard K Spielberger, Maple Grove, MN (US);
Assignee:
Honeywell Inc., Minneapolis, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438 18 ; 438106 ; 438612 ;
Abstract
A process of providing a bond pad arrangement for use with a thermocompression wire bonder including a primary bond pad for connection of an integrated circuit during a production assembly process, and a secondary test bond pad contiguous with the primary bond pad for connection of a wire to the integrated circuit. Including performing a test sequence, and removing the wire from the secondary test bond pad.