Tetsuji Kiyota

Title: Tetsuji Kiyota: Innovator in Sputtering Technology

Introduction

Tetsuji Kiyota is a notable inventor based in Chigasaki, Japan. He has made significant contributions to the field of sputtering technology, holding a total of 2 patents. His work focuses on improving the efficiency and effectiveness of sputtering apparatuses used in various applications.

Latest Patents

Kiyota's latest patents include a sputtering apparatus designed for filling pores of a circular substrate. This innovative apparatus maintains a distance between the target and the substrate that is greater than the diameter of the circular substrate wafer. It also ensures that the internal gas pressure level of the vacuum chamber does not exceed 1×10 Pa during the sputtering process, effectively filling pores without generating dust and void spaces. Another significant patent is for a magnetron sputtering apparatus that features an improved magnetic field distribution on the surface of the target. This design allows for satisfactory film formation in every recess of the substrate, with the magnet configured to produce specific magnetic field intensities necessary for efficient operation.

Career Highlights

Throughout his career, Kiyota has worked with prominent companies in the industry, including Ulvac, Inc. and Nihon Shinku Gijutsu Kabushiki Kaisha. His experience in these organizations has contributed to his expertise in sputtering technology and innovation.

Collaborations

Kiyota has collaborated with notable colleagues such as Hisaharu Obinata and Satoru Toyoda. These partnerships have likely enhanced his research and development efforts in the field.

Conclusion

Tetsuji Kiyota's contributions to sputtering technology through his patents and career achievements highlight his role as an influential inventor. His work continues to impact the industry positively.