The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2001
Filed:
Nov. 03, 1997
Applicant:
Inventors:
Hisaharu Obinata, Susono, JP;
Tetsuji Kiyota, Chigasaki, JP;
Satoru Toyoda, Chigasaki, JP;
Yoshiyuki Kadokura, Susono, JP;
Assignee:
ULVAC, Inc., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 1/434 ;
U.S. Cl.
CPC ...
C23C 1/434 ;
Abstract
A sputtering apparatus in which the distance between a target and a substrate is made to be at least greater than the diameter of the circular substrate wafer and an internal gas pressure level of a vacuum chamber is held to be not higher than 1×10,Pa during sputtering process, thereby capable of effectively filling pores provided on the substrate without generating dust and void spaces.