This inventor holds 1 USPTO granted patent. Top assignee: Ulvac, Inc.. Active years: 2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2001
Title: Hisaharu Obinata: Innovator in Sputtering Technology
Introduction
Hisaharu Obinata is a notable inventor based in Susono, Japan. He has made significant contributions to the field of sputtering technology, particularly in the development of apparatuses that enhance substrate processing.
Latest Patents
His most recent patent is a sputtering apparatus designed for filling pores of a circular substrate. This innovative device ensures that the distance between the target and the substrate is greater than the diameter of the circular substrate wafer. Additionally, it maintains an internal gas pressure level in the vacuum chamber not exceeding 1×10 Pa during the sputtering process. This design effectively fills the pores on the substrate without generating dust and void spaces, showcasing his commitment to advancing technology in this area.
Career Highlights
Hisaharu Obinata is currently employed at ULVAC, Inc., a company known for its cutting-edge technology in vacuum equipment and materials. His work at ULVAC has allowed him to focus on innovations that improve manufacturing processes in various industries.
Collaborations
Throughout his career, Obinata has collaborated with esteemed colleagues such as Tetsuji Kiyota and Satoru Toyoda. These partnerships have fostered a creative environment that encourages the exchange of ideas and technological advancements.
Conclusion
Hisaharu Obinata's contributions to sputtering technology exemplify his dedication to innovation and excellence. His work continues to influence the industry, paving the way for future advancements in substrate processing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile