Location History:
- Kanagawa-ken, JP (2002)
- Kanagawa, JP (2007)
- Tokyo, JP (2002 - 2009)
Company Filing History:
Years Active: 2002-2009
Title: Teruhiko Ichimura: Innovator in Substrate Holding Technology
Introduction
Teruhiko Ichimura is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the development of substrate holding apparatuses. With a total of 6 patents to his name, Ichimura's work has been instrumental in enhancing the efficiency and effectiveness of polishing processes for semiconductor wafers.
Latest Patents
Ichimura's latest patents include innovative designs for substrate holding apparatuses and polishing apparatuses. These inventions focus on improving the way substrates, such as semiconductor wafers, are held during the polishing process. The substrate holding apparatus features a top ring body with a receiving space and a vertically movable member. An abutment member with an elastic membrane is attached to the lower surface of the movable member. This design allows for better contact with the substrate, ensuring a flat finish. The elastic membrane consists of an abutment portion with a flange that contacts the substrate and a connecting portion made of a more flexible material, enhancing the overall performance of the apparatus.
Career Highlights
Ichimura is associated with Ebara Corporation, a leading company in the field of semiconductor manufacturing equipment. His work at Ebara has allowed him to focus on innovations that directly impact the efficiency of semiconductor production. His contributions have been recognized within the industry, making him a respected figure among his peers.
Collaborations
Ichimura has collaborated with notable coworkers, including Tetsuji Togawa and Osamu Nabeya. These collaborations have fostered an environment of innovation and have led to the development of advanced technologies in the semiconductor field.
Conclusion
Teruhiko Ichimura's contributions to substrate holding technology have significantly advanced the semiconductor manufacturing process. His innovative patents and collaborations with industry professionals continue to shape the future of this critical field.