The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2007
Filed:
Apr. 17, 2003
Tetsuji Togawa, Tokyo, JP;
Makoto Fukushima, Tokyo, JP;
Kunihiko Sakurai, Tokyo, JP;
Hiroshi Yoshida, Tokyo, JP;
Osamu Nabeya, Tokyo, JP;
Teruhiko Ichimura, Kanagawa, JP;
Tetsuji Togawa, Tokyo, JP;
Makoto Fukushima, Tokyo, JP;
Kunihiko Sakurai, Tokyo, JP;
Hiroshi Yoshida, Tokyo, JP;
Osamu Nabeya, Tokyo, JP;
Teruhiko Ichimura, Kanagawa, JP;
Ebara Corporation, Tokyo, JP;
Abstract
The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface () with use of a top ring () for holding the semiconductor wafer (W). A pressure chamber () is defined in the top ring () by attaching an elastic membrane () to a lower surface of a vertically movable member (). The semiconductor wafer (W) is polished while a pressurized fluid is supplied to the pressure chamber () so that the semiconductor wafer (W) is pressed against the polishing surface () by a fluid pressure of the fluid. The semiconductor wafer (W) which has been polished is released from the top ring () by ejecting the pressurized fluid from an opening () defined centrally in the vertically movable member ().