The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2002

Filed:

Oct. 02, 2000
Applicant:
Inventors:

Shin Ohwada, Tokyo, JP;

Teruhiko Ichimura, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 2/900 ;
U.S. Cl.
CPC ...
B24B 2/900 ;
Abstract

The present invention provides a substrate holding apparatus which can adjust a holding state of a substrate in accordance with a polishing state, and maintain uniformity of a polishing amount over an entire surface of the substrate, or control the polishing amount intentionally. The substrate holding apparatus comprises a holding plate having a holding surface for a substrate, a cover element for covering a backside surface of the holding plate to form a sealed back pressure space at the backside surface side, a plurality of through-holes distributed over the substantially entire holding surface for allowing the holding surface to communicate with the back pressure space, a division element removably provided for dividing the back pressure space between the holding plate and the cover element into a plurality of predetermined sealed divisional spaces in a plane, and a back pressure controller for individually controlling back pressures in the divisional spaces.


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