Tokyo, Japan

Shin Ohwada

This inventor holds 2 USPTO granted patents. Top assignee: Ebara Corporation. Active years: 2001-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shin Ohwada. Retrieved from https://idiyas.com/inventor/shin-ohwada

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.9

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2001-2002

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Shin Ohwada

Introduction

Shin Ohwada is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor manufacturing through his innovative designs and inventions. With a total of 2 patents, Ohwada has demonstrated his expertise and commitment to advancing technology.

Latest Patents

Ohwada's latest patents include a wafer holder and a polishing device. The wafer holder is designed to provide a substrate holding apparatus that can adjust the holding state of a substrate according to the polishing state. This invention ensures uniformity in the polishing amount across the entire surface of the substrate while allowing for intentional control of the polishing amount. The apparatus features a holding plate with a holding surface, a cover element that creates a sealed back pressure space, and a division element that divides the back pressure space into multiple sealed divisional spaces. Additionally, a back pressure controller is included to manage the back pressures in these spaces.

The polishing device is an apparatus for polishing workpieces, such as semiconductor wafers, to a flat mirror finish. It consists of a turntable with a polishing cloth and a top ring that presses the semiconductor wafer between the turntable and itself. A presser ring is vertically movable around the top ring, and a pressing device applies a variable pressing force to the presser ring against the polishing cloth. This innovative design enhances the efficiency and effectiveness of the polishing process.

Career Highlights

Shin Ohwada is currently employed at Ebara Corporation, where he continues to develop cutting-edge technologies in the semiconductor industry. His work has significantly impacted the efficiency of semiconductor manufacturing processes.

Collaborations

Ohwada has collaborated with notable colleagues, including Teruhiko Ichimura and Norio Kimura. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Shin Ohwada's contributions to the field of semiconductor manufacturing through his patents and collaborative efforts highlight his role as a key innovator. His inventions, particularly the wafer holder and polishing device, demonstrate his commitment to advancing technology in this critical industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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