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Teruaki Nishinaka

USPTO Granted Patents = 15 (Patent Applications = 2)

Average Co-Inventor Count = 2.4

ph-index = 7

Forward Citations = 268(Granted Patents)

Location History:

Kasuga, JP (1996 - 1999)
Fukuoka, JP (1997 - 2000)
Tosu, JP (2006 - 2009)
Saga-ken, JP (2009)
Saga, JP (2010 - 2011)
Osaka, JP (2012 - 2016)

Company Filing History:

7 out of 27,375

Matsushita Electric Industrial Co., Ltd.

patents

5 out of 16,453

Panasonic Corporation

patents

3 out of 13,319

Panasonic Intellectual Property Management Co., Ltd.

patents

Years Active: 1996-2025

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15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12247827 - Bead appearance inspection device, bead appearance inspection method, program, and bead appearance inspection system (2025-03-11),

2. 9439336 - Component mounting system (2016-09-06),

3. 9332681 - Electronic component mounting system (2016-05-03),

4. 8293652 - Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method (2012-10-23),

5. 7989803 - Manufacturing method for semiconductor chips and semiconductor wafer (2011-08-02),

6. 7797822 - Electronic component mounting method (2010-09-21),

7. 7629228 - Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks (2009-12-08),

8. 7488668 - Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regions (2009-02-10),

9. 7107672 - Method of mounting electronic parts on a flexible printed circuit board (2006-09-19),

10. 6013899 - Method and apparatus for mounting soldering balls onto electrodes of a (2000-01-11),

11. 5894984 - Structure of electronic parts and method of soldering electronic parts (1999-04-20),

12. 5779958 - Method for packaging electronic device (1998-07-14),

13. 5695667 - Method and apparatus for mounting soldering balls onto electrodes of a (1997-12-09),

14. 5655704 - Method and apparatus for mounting soldering balls onto electrodes of a (1997-08-12),

15. 5548891 - Method of automatically mounting electronic connector onto an end of (1996-08-27),

Title: Teruaki Nishinaka - Pioneering Inventor from Saga, Japan

Introduction: Teruaki Nishinaka is a renowned inventor hailing from Saga, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Teruaki Nishinaka holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Nishinaka has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant advancements in various industries.

Collaborations: Throughout his career, Teruaki Nishinaka has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Teruaki Nishinaka's passion for innovation, coupled with his relentless pursuit of excellence, has solidified his reputation as a trailblazer in the world of inventions, inspiring the next generation of inventors to push the boundaries of what is possible.

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