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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9332681 B1

PDFFull Text
Date of Patent:
May. 03, 2016

Filed:

Nov. 15, 2013

Electronic component mounting system

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Masayuki Mantani, Yamanashi, JP;

Teruaki Nishinaka, Osaka, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Kiley Stoner

Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 37/00 (2006.01); H05K 13/00 (2006.01); H05K 13/04 (2006.01); H05K 13/08 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 31/12 (2006.01); B23K 3/06 (2006.01); H05K 3/12 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0015 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); B23K 3/0638 (2013.01); B23K 31/12 (2013.01); H05K 3/34 (2013.01); H05K 13/04 (2013.01); H05K 13/0465 (2013.01); H05K 13/08 (2013.01); H05K 3/1216 (2013.01); H05K 3/3484 (2013.01); H05K 2203/04 (2013.01); H05K 2203/163 (2013.01); H05K 2203/166 (2013.01);
Abstract

In a case where a solder amount of a solder portion printed on an electrode does not meet a reference amount, solder is additionally applied to a center position of the electrode by a control section. With respect to a component mounting position to which the solder is not additionally applied, correction from a component mounting position of a substrate to a corrected mounting position is performed and an electronic component is mounted at the corrected mounting position. The electronic component corresponding to another component mounting position with the solder additionally applied thereto is mounted at the design component mounting position in the positioned substrate.

Find Patent Forward Citations

Mantani, Masayuki. (2016). Electronic component mounting system (U.S. Patent No. 9332681). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9332681

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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