The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 1999
Filed:
Apr. 10, 1996
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
An improved structure of an electronic part with solder bumps is provided. The electronic part includes, for example, an IC chip and a board. The solder bumps are disposed on the bottom surface of the board and have a melting point greater than a thermal deformation temperature of the board. With this arrangement, if the curved board is bonded to a substrate in a soldering process, the solder bumps are solidified at a higher temperature than the thermal deformation temperature of the board during a cooling process, thereby preventing the curved board which has been straightened once above the thermal deformation temperature from being returned to its original shape. Several modifications are disclosed.