Georgetown, Malaysia

Terrence Huat Hin Tan


Average Co-Inventor Count = 6.6

ph-index = 1


Company Filing History:


Years Active: 2018-2022

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4 patents (USPTO):

Certainly! Here is the article about inventor Terrence Huat Hin Tan:

Title: The Innovative Mind of Terrence Huat Hin Tan

Introduction: Terrence Huat Hin Tan, a talented inventor based in Georgetown, Malaysia, has made significant contributions to the field of integrated circuit technology. With a total of 4 patents to his name, Tan is known for his groundbreaking work in die testing and three-dimensional integrated circuits.

Latest Patents:

1. **Die Stack Override for Die Testing:** Tan's patent introduces novel structures and techniques for exposing circuitry in die testing. By incorporating die stack emulation circuitry and innovative switch mechanisms, this invention revolutionizes the testing process for integrated circuit dies.

2. **Test Architecture for Die-to-Die Interconnect for Three-Dimensional Integrated Circuits:** Tan's second patent showcases a die-to-die repeater circuit designed for three-dimensional integrated circuits. By integrating transmit and receive circuits with flip flops, this technology ensures efficient data transmission and proper operation checks.

Career Highlights: Currently employed at Intel Corporation, a leading technology company, Terrence Huat Hin Tan continues to push the boundaries of innovation in the semiconductor industry. His expertise and dedication have significantly advanced the development of cutting-edge integrated circuit technologies at Intel Corporation.

Collaborations: Tan collaborates closely with esteemed colleagues Wei Ming Lim and Sreejit Chakravarty at Intel Corporation. Together, they form a dynamic team driving forward technological advancements in the field of semiconductor engineering.

Conclusion: Terrence Huat Hin Tan's ingenuity and passion for innovation have established him as a key figure in the realm of integrated circuit technology. His patents and contributions not only enhance the efficiency of die testing processes but also pave the way for the future of three-dimensional integrated circuits. Tan's collaboration with his peers at Intel Corporation underscores his commitment to excellence and his pivotal role in shaping the industry's technological landscape.

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