Penang, Malaysia

Tek Seng Tan

USPTO Granted Patents = 5 

Average Co-Inventor Count = 5.0

ph-index = 5

Forward Citations = 41(Granted Patents)


Location History:

  • Bayan Lepas Penang, MY (2007)
  • Panang, MY (2007)
  • Penang, MY (2009 - 2011)

Company Filing History:


Years Active: 2007-2011

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5 patents (USPTO):Explore Patents

Title: Innovations by Tek Seng Tan

Introduction

Tek Seng Tan is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of thermal interface materials, holding a total of 5 patents. His work focuses on enhancing the performance and reliability of thermal management solutions in various applications.

Latest Patents

One of his latest patents is titled "Void reduction in indium thermal interface material." This patent describes a thermal interface material that includes an indium preform with a first surface and a second surface opposite to the first surface. The preform features an interior portion and a peripheral boundary, with a channel extending from the peripheral boundary towards the interior portion. This innovative design allows for the liberation of flux during thermal cycling, thereby improving the material's performance.

Career Highlights

Tek Seng Tan is currently employed at Advanced Micro Devices Corporation, a leading company in the semiconductor industry. His work at AMD has allowed him to apply his expertise in thermal interface materials to develop cutting-edge solutions for high-performance computing.

Collaborations

Throughout his career, Tek Seng has collaborated with talented individuals such as Seah Sun Too and Keng Sang Cha. These collaborations have contributed to the advancement of technology in their respective fields.

Conclusion

Tek Seng Tan's contributions to thermal interface materials demonstrate his commitment to innovation and excellence in engineering. His patents reflect a deep understanding of material science and its applications in technology.

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