The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2011

Filed:

Dec. 15, 2009
Applicants:

Seah Sun Too, San Jose, CA (US);

Hsiang Wan Liau, Penang, MY;

Janet Kirkland, Fremont, CA (US);

Tek Seng Tan, Penang, MY;

Maxat Touzelbaev, San Jose, CA (US);

Raj N. Master, San Jose, CA (US);

Inventors:

Seah Sun Too, San Jose, CA (US);

Hsiang Wan Liau, Penang, MY;

Janet Kirkland, Fremont, CA (US);

Tek Seng Tan, Penang, MY;

Maxat Touzelbaev, San Jose, CA (US);

Raj N. Master, San Jose, CA (US);

Assignee:

Advanced Micro Devices, Inc., Sunnvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.


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