The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2009
Filed:
Nov. 30, 2005
Keng Sang Cha, Penang, MY;
Tek Seng Tan, Penang, MY;
Haris Fazelah, Penang, MY;
Ahmad Zahrain B. Mohamad Shakir, Penang, MY;
Keng Sang Cha, Penang, MY;
Tek Seng Tan, Penang, MY;
Haris Fazelah, Penang, MY;
Ahmad Zahrain B. Mohamad Shakir, Penang, MY;
Advanced Micro Devices, Inc., Austin, TX (US);
Abstract
In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package substrate. A data processor analyzes the camera image to determine an occurrence of an unacceptable condition of the underfill material. Pre-heating and/or post-heating of the package substrate before and/or after dispensing the underfill material by a contact-less heater ensures uniform spreading of the underfill material.