The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2007
Filed:
Jun. 03, 2004
Seah Sun Too, San Jose, CA (US);
Edward Alcid, Sunnyvale, CA (US);
Ahmad Juwanda, Bayan Lepas Penang, MY;
Keng Sang Cha, Kumbar Penang, MY;
Leang Hua Kam, Georgetown Penang, MY;
Tek Seng Tan, Bayan Lepas Penang, MY;
Seah Sun Too, San Jose, CA (US);
Edward Alcid, Sunnyvale, CA (US);
Ahmad Juwanda, Bayan Lepas Penang, MY;
Keng Sang Cha, Kumbar Penang, MY;
Leang Hua Kam, Georgetown Penang, MY;
Tek Seng Tan, Bayan Lepas Penang, MY;
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A method for coupling a lid to a support substrate having a semiconductor chip coupled thereto and a clamp fixture. Each semiconductor component has a semiconductor chip mounted to a semiconductor component and a lid coupled to the support substrate via a lid attach material. The lid attach material is cured either using a two-step process that includes a partial cure step followed by a clampless cure step or by curing the die attach material in a clamp fixture without including a pre-cure step. The semiconductor component manufacture decides on the curing approach based on cost and the number of semiconductor components being manufactured. If the semiconductor manufacturer opts for curing with a clamp fixture, the clamp fixture includes a base plate insert on which the semiconductor components are placed and a compression mechanism that includes a compression plate having a compressive material disposed thereon.