Leang Hua Kam

Title: Leang Hua Kam: Semiconductor Packaging and Inspection Innovations.

Introduction

Leang Hua Kam is an inventor based in Georgetown, Malaysia, whose patent work addresses semiconductor packaging and inspection. Her listed portfolio includes 2 patents, and her company affiliation is Advanced Micro Devices Corporation.

Latest Patents

“Methods and Fixture for Coupling a Lid to a Support Substrate” describes ways to attach a lid to a substrate supporting a semiconductor chip. The lid-attach material can be cured through a two-step process, with a partial cure followed by a clampless cure, or by curing it in a clamp fixture without a pre-cure step. The manufacturing approach is selected according to cost and production volume. The fixture design includes a base plate insert and a compression mechanism with a plate bearing compressive material.

“Inspection for Alignment Between IC Die and Package Substrate” presents a method and system for checking alignment between an integrated-circuit die and its package substrate. Fiducials on the substrate establish reference points used to determine its center. The method then checks whether the die’s center falls within an acceptable range of the substrate’s center.

Career Highlights

Kam’s listed inventions focus on practical challenges in semiconductor manufacturing: attaching package lids and verifying die-to-substrate alignment. These processes support consistent assembly and inspection of semiconductor components.

Collaborations

Kam is associated with Advanced Micro Devices Corporation. Her listed coworkers include Swee Peng Lee and Keng Sang Cha.

Conclusion

Leang Hua Kam’s patent work reflects a focus on semiconductor packaging processes and precise component alignment, contributing to manufacturing and inspection methods at Advanced Micro Devices Corporation.