The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2006

Filed:

Apr. 07, 2004
Applicants:

Swee Peng Lee, Penang, MY;

Ajit Dubey, Cupertino, CA (US);

Leang Hua Kam, Penang, MY;

Loo Kean Teoh, Penang, MY;

Inventors:

Swee Peng Lee, Penang, MY;

Ajit Dubey, Cupertino, CA (US);

Leang Hua Kam, Penang, MY;

Loo Kean Teoh, Penang, MY;

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G08B 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method and system for inspecting alignment between an IC (integrated circuit) die and a package substrate, a plurality of fiducials are located on the package substrate for determining a plurality of references. A center point of the package substrate is determined from the plurality of references. In addition, whether a center point of the IC die is aligned to the center point of the package substrate within an acceptable range is determined.


Find Patent Forward Citations

Lee, Swee. (2006). Inspection for alignment between ic die and package substrate (U.S. Patent No. 7030772). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7030772

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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