Penang, Malaysia

Swee Peng Lee

This inventor holds 2 USPTO granted patents. Top assignee: Advanced Micro Devices Corporation. Active years: 2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Swee Peng Lee. Retrieved from https://idiyas.com/inventor/swee-peng-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2006

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2 patents (USPTO):Explore Patents

Title: Innovations by Swee Peng Lee in Integrated Circuit Technology

Introduction

Swee Peng Lee is an innovative inventor based in Penang, Malaysia. With a focus on advancements in integrated circuit (IC) technology, he holds two patents that significantly contribute to the field. His work embodies the spirit of innovation prevalent in the tech industry, particularly in the realm of microelectronics.

Latest Patents

One of Swee Peng Lee's most recent patents is a "Method and system for aligning IC die to package substrate." This invention provides a systematic approach for accurately placing an IC die onto a package substrate. The process involves determining a first reference point after the location of a first fiducial on the substrate, as well as a second reference after locating a second fiducial. The alignment method ensures that the IC die is perfectly positioned with respect to the references of the fiducials, which include a series of dots.

Another significant patent is titled "Inspection for alignment between IC die and package substrate." This patent outlines a method to inspect whether the IC die’s center is aligned with the center of the package substrate. By locating multiple fiducials and determining references, the method allows for precise alignment checks, ensuring quality and reliability in semiconductor production.

Career Highlights

Swee Peng Lee works at Advanced Micro Devices Corporation, a leader in the semiconductor industry. His contributions to the development of next-generation microelectronics align with the company's commitment to innovation and excellence. Throughout his career, he has effectively utilized his expertise to improve manufacturing processes and product reliability in IC technology.

Collaborations

Collaborating with accomplished professionals such as Ajit M Dubey and Leang Hua Kam, Swee Peng Lee has fostered a dynamic environment for innovation. These partnerships have been instrumental in the advancement of early-stage technologies and patent development, significantly enhancing the capabilities within their domain.

Conclusion

Swee Peng Lee's dedication to enhancing integrated circuit technology is evident through his patented innovations. His unique methods for die alignment and inspection have positioned him as a key player in the semiconductor field. With continued collaboration and commitment to research and development, Swee Peng Lee is sure to make further impactful contributions in the realm of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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