IDiyas

For the Inventor, By the Inventor

Simpang Ampat, Malaysia

Teik Tiong Toong

USPTO Granted Patents = 6

Average Co-Inventor Count = 2.2

ph-index = 2

Forward Citations = 13(Granted Patents)


Location History:

  • Penang, MY (2011 - 2013)
  • Siam, MY (2013 - 2015)
  • Simpang Ampat, MY (2014 - 2017)

Company Filing History:

goldMedal6 out of 4,284 
 
Altera Corporation
 patents

Years Active: 2011-2017

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6 patents (USPTO):Explore Patents
1. 9601419 - Stacked leadframe packages (2017-03-21),
2. 9054077 - Package having spaced apart heat sink (2015-06-09),
3. 8786080 - Systems including an I/O stack and methods for fabricating such systems (2014-07-22),
4. 8541263 - Thermoset molding for on-package decoupling in flip chips (2013-09-24),
5. 8525326 - IC package with capacitors disposed on an interposal layer (2013-09-03),
6. 7989942 - IC package with capacitors disposed on an interposal layer (2011-08-02),
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