The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Mar. 10, 2010
Ken Beng Lim, Bayan Lepas, MY;
Teik Tiong Toong, Siam, MY;
Ken Beng Lim, Bayan Lepas, MY;
Teik Tiong Toong, Siam, MY;
Altera Corporation, San Jose, CA (US);
Abstract
An integrated circuit (IC) package that includes a lead frame, and a die affixed to a first surface of a pad of the lead frame. The die is wire bonded to the lead frame. The package includes a heat sink spaced apart from a second surface of the pad, where the second surface opposes the first surface. Molding compound encapsulates the lead frame and the die. The molding compound is disposed between the heat sink and the second surface of the pad and is enabled access between the heat sink and the second surface through protruding features disposed on the heat sink, the second surface, and/or some combination of the two.