This inventor holds 5 USPTO granted patents and 1 published patent application. Top assignee: Altera Corporation. Active years: 2013-2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Bayan Lepos, MY (2013)
- Bayan Lepas, MY (2015 - 2017)
Company Filing History:
Years Active: 2013-2017
Title: Ken Beng Lim - Innovator in Package Substrate Technology
Introduction
Ken Beng Lim is a notable inventor based in Bayan Lepas, Malaysia. He has made significant contributions to the field of integrated circuit technology, particularly in the area of package substrate warpage and heat spreading structures. With a total of 5 patents to his name, Lim continues to push the boundaries of innovation in his field.
Latest Patents
One of Lim's latest patents is the "Package substrate warpage reshaping apparatus and method." This invention provides a solution for reshaping the warpage profile of package substrates. The apparatus consists of a metal boat with multiple cavities, where package substrates are placed. It also includes a series of planar boards and spring-loaded clips that ensure each board is pressed against its respective substrate. This innovative design allows for effective reshaping of warpage profiles, enhancing the reliability of electronic components.
Another significant patent by Lim is related to "Heat spreading structures for integrated circuits." This invention features a heat spreader structure that includes both a planar portion and a slanted portion. The slanted portion extends at an angle from the edge of the planar portion, optimizing heat dissipation in integrated circuits. The design allows for the use of different manufacturing methods, showcasing Lim's versatility and forward-thinking approach in engineering.
Career Highlights
Ken Beng Lim is currently employed at Altera Corporation, a leading company in the field of programmable logic devices. His work at Altera has allowed him to collaborate with other talented engineers and contribute to groundbreaking technologies in the semiconductor industry.
Collaborations
Lim has worked alongside notable colleagues such as Ping Chet Tan and Teik Tiong Toong. Their combined expertise has fostered an environment of innovation and creativity, leading to the development of advanced technologies in their field.
Conclusion
Ken Beng Lim is a distinguished inventor whose work in package substrate technology and heat spreading structures has made a significant impact on the electronics industry. His innovative patents and collaborations continue to inspire advancements in integrated circuit design.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile