The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9330997 B1

PDF
Full Text
Expired
Date of Patent:
May. 03, 2016

Filed:

Mar. 14, 2014
Applicant:

Altera Corporation, San Jose, CA (US);

Inventors:

Ken Beng Lim, Bayan Lepas, MY;

Myung June Lee, Cupertino, CA (US);

Yuan Li, Sunnyvale, CA (US);

Ping Chet Tan, Gelugor, MY;

Assignee:

Altera Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 21/4882 (2013.01);
Abstract

A heat spreader structure includes a planar portion and a slanted portion. The slanted portion extends at an angle from an edge of the planar portion. The first slanted portion includes a first slot. A second heat spreader structure includes a planar member, a first edge member and a second edge member. The first edge member extends only perpendicularly from a first edge of the planar member whereas the second edge member extends from the second edge of the planar member and has a slanted surface with respect to that of the planar member. In addition to that, the first and second heat spreader structure may be formed using different manufacturing methods.


Find Patent Forward Citations

Lim, Ken. (2016). Heat spreading structures for integrated circuits (U.S. Patent No. 9330997). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9330997

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