logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9076776 B1

PDFFull Text
Expired
Date of Patent:
Jul. 07, 2015

Filed:

Nov. 19, 2009

Integrated circuit package with stand-off legs

Applicants:

Ken Beng Lim, Bayan Lepas, MY;

Ping Chet Tan, Gelugor, MY;

Inventors:

Ken Beng Lim, Bayan Lepas, MY;

Ping Chet Tan, Gelugor, MY;

Assignee:

Altera Corporation, San Jose, CA (US);

Attorneys:

Mauriel Kapouytian Woods LLP

Ararat Kapouytian

Primary Examiner:

Teresa M Arroyo

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/02 (2006.01); H01L 23/22 (2006.01); H01L 23/24 (2006.01); H01L 23/48 (2006.01); H01L 23/28 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 2924/152 (2013.01); H01L 2924/1515 (2013.01); H01L 2924/151 (2013.01); H01L 2924/1511 (2013.01); H01L 2924/18301 (2013.01); H01L 21/52 (2013.01); H01L 21/565 (2013.01); H01L 23/28 (2013.01); H01L 2924/181 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/01029 (2013.01);
Abstract

Provided is a lead frame package with stand-off legs to prevent the die attach pad (DAP), which is part of the package substrate, to tilt or shift from its original position during the molding process. Also provided are methods for assembling such lead frame packages into various integrated circuit (IC) packages. Compared to conventional lead frame packages without stand-off legs, the lead frame packages of the present invention have less aesthetic and functional defects, thereby leading to an increase in product reliability and yield.

Find Patent Forward Citations

Lim, Ken. (2015). Integrated circuit package with stand-off legs (U.S. Patent No. 9076776). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9076776

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…