Tee Onn Chong

Title: Innovations by Tee Onn Chong

Introduction

Tee Onn Chong is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of electronics, particularly in the design and fabrication of advanced electronic packages. With a total of 2 patents to his name, his work reflects a commitment to innovation and technological advancement.

Latest Patents

Chong's latest patents include an "Electronic package with high density interconnect and associated methods." This invention describes an electronics package that features an integrated circuit (IC) coupled to an IC substrate in a flip-chip ball grid array (FCBGA) configuration. The IC is designed with a high-density pattern of interconnect pads around its periphery, allowing for efficient coupling to a corresponding pattern of bonding pads on the IC substrate. The unique arrangement of substrate bonding pads accommodates a high density of interconnect pads while considering various geometrical constraints. Additionally, the invention includes methods of fabrication and applications for electronic systems and data processing systems.

Another significant patent is the "Enhanced plated-through hole and via contact design." This invention provides a circuit board with a plated-through hole, where one end is electrically attached to a cap made of conductive material. The design includes surface pads that connect to the cap via vias extending from the cap to the surface pads. This innovation is particularly useful for circuit boards that serve as substrates for mounting integrated circuits, such as ball-grid array integrated circuits.

Career Highlights

Tee Onn Chong is currently employed at Intel Corporation, where he continues to push the boundaries of electronic design and innovation. His work at Intel has allowed him to collaborate with some of the brightest minds in the industry, contributing to the advancement of technology.

Collaborations

Chong has worked alongside notable colleagues such as Seng Hooi Ong and Robert L Sankman. Their collaborative efforts have further enhanced the innovative projects they have undertaken together.

Conclusion

Tee Onn Chong's contributions to the field of electronics through his patents and work at Intel Corporation highlight his role as a significant inventor. His innovative designs and collaborative spirit continue to influence the industry positively.