The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2002

Filed:

Dec. 15, 1999
Applicant:
Inventors:

Tee Onn Chong, Chandler, AZ (US);

Chris Baldwin, Tempe, AZ (US);

Chee-Yee Chung, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 ;
U.S. Cl.
CPC ...
H05K 1/11 ;
Abstract

The present invention provides a circuit board with a plated-through hole, wherein a first end of the plated-through hole is electrically attached to a cap formed of conductive material. One or more surface pads terminate on a surface layer of the printed circuit board, and are connected to the cap by one or more vias extending from the cap to the one or more surface pads. In some embodiments, the circuit board is a substrate for mounting an integrated circuit, such as a ball-grid array integrated circuit. The invention includes methods for making the novel circuit board, as well as integrated circuit assemblies comprising the novel circuit board with an integrated circuit mounted thereto.


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