Chandler, AZ, United States of America

Chris Baldwin

USPTO Granted Patents = 3 

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 21(Granted Patents)


Location History:

  • Tempe, AZ (US) (2002)
  • Chandler, AZ (US) (2004)

Company Filing History:


Years Active: 2002-2004

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3 patents (USPTO):Explore Patents

Title: The Innovative Mind of Chris Baldwin

Introduction

Chris Baldwin, an accomplished inventor based in Chandler, AZ, has established himself in the field of integrated circuits and electronic packaging. Holding three patents under his name, Baldwin has contributed significantly to advancements in technology through his insightful designs and innovative approaches.

Latest Patents

Two of Chris Baldwin's most notable patents include:

1. **Power/Ground Configuration for Low Impedance Integrated Circuit** - This invention involves an integrated circuit comprising a die, a power terminal, and a ground terminal. All components are meticulously mounted onto a substrate, where the design features a power terminal with a body and a first extension, alongside a ground terminal with a body and a second extension. Crucially, the second extension is placed adjacent to the first extension to minimize the inductance generated when supplying current to the die via the power terminal.

2. **Mechanical Support System for a Thin Package** - In this patent, Baldwin has designed an electronic package that integrates an IC, such as a die, mounted on one side of a thin interposer, while a pin carrier is attached to the opposite side. This inventive structure includes a cavity beneath the die in the pin carrier, allowing for additional electronic components like capacitors to be mounted underneath. The cavity is filled with an encapsulant, providing mechanical support to the thin interposer during operation, thus enhancing the durability and functionality of electronic systems.

Career Highlights

Chris Baldwin is currently employed at Intel Corporation, a leading technology company recognized for its significant contributions to the computing industry. His role within Intel has afforded him the opportunity to work on various cutting-edge projects related to electronic design and innovation.

Collaborations

Throughout his career, Baldwin has collaborated with talented colleagues such as Tee Onn Chong and Chee-Yee Chung. These collaborations highlight the strength of teamwork in the innovation process, leading to fruitful developments and the successful attainment of patents.

Conclusion

Chris Baldwin continues to make strides in the field of integrated circuits and electronic packaging. His inventive solutions and collaborative spirit not only propel his professional journey but also contribute to the broader technological advancements that enhance our daily lives. As he progresses in his career, the impact of his inventions will undoubtedly resonate in the industry for years to come.

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