Company Filing History:
Years Active: 2019-2021
Title: Teck Guan Lim: Innovator in Semiconductor and Optical Technologies
Introduction
Teck Guan Lim is a prominent inventor based in Singapore, known for his contributions to semiconductor and optical technologies. With a total of four patents to his name, Lim has made significant advancements in the field, particularly in the design and formation of semiconductor packages and optical assemblies.
Latest Patents
One of Lim's latest patents is titled "Semiconductor package and method of forming the same." This invention outlines a semiconductor package that includes a substrate with a via hole, a chip attached to the substrate, and a prefabricated ferromagnetic pin. The design features a first magnetic shield structure and a second magnetic shield structure, ensuring that a portion of the chip is positioned between these shields for enhanced performance.
Another notable patent is the "Optical assembly and method of forming the same." This invention describes an optical assembly that consists of a substrate with grooves and a photonic integrated circuit chip. The assembly includes cylindrical rods that help align the coupling waveguide with an optical fiber, showcasing Lim's innovative approach to optical technology.
Career Highlights
Teck Guan Lim has worked with esteemed organizations such as the Agency for Science, Technology and Research and Globalfoundries Singapore Pte. Ltd. His experience in these companies has allowed him to refine his skills and contribute to groundbreaking technologies in the semiconductor and optical fields.
Collaborations
Throughout his career, Lim has collaborated with notable professionals, including Surya Bhattacharya and Hideaki Fukuzawa. These collaborations have further enriched his work and led to advancements in his projects.
Conclusion
Teck Guan Lim's innovative contributions to semiconductor and optical technologies have established him as a key figure in his field. His patents reflect a commitment to advancing technology and improving the efficiency of electronic components.