The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Sep. 03, 2018
Agency for Science, Technology and Research, Singapore, SG;
Teck Guan Lim, Singapore, SG;
Surya Bhattacharya, Singapore, SG;
Agency for Science, Technology and Research, Singapore, SG;
Abstract
Various embodiments may relate to a method of forming a photonic integrated circuit package (PIC). The method may include forming a redistribution layer (RDL) over a carrier. The method may also include forming a through hole or cavity on the redistribution layer. The method may additionally include providing a stop-ring structure, the stop-ring structure including a ring of suitable material, the stop-ring structure defining a hollow space, over the redistribution layer so that the hollow space is over the through hole or cavity. The method may further include arranging a photonic integrated circuit (PIC) die over the redistribution layer so that the photonic integrated circuit (PIC) die is on the stop-ring structure. The method may also include forming a molded package by forming a mold structure to at least partially cover the photonic integrated circuit (PIC) die to form the photonic integrated circuit package.