The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

May. 31, 2017
Applicants:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Institute of Microelectronics, Singapore, SG;

Inventors:

Bhushan Bharat, Singapore, SG;

Shan Gao, Singapore, SG;

Danny Pak-Chum Shum, Singapore, SG;

Wanbing Yi, Singapore, SG;

Juan Boon Tan, Singapore, SG;

Wei Yi Lim, Singapore, SG;

Teck Guan Lim, Singapore, SG;

Michael Han Kim Kwong, Singapore, SG;

Eva Wai Leong Ching, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/22 (2006.01); H01L 23/00 (2006.01); H01L 43/02 (2006.01); H01L 23/13 (2006.01); H01L 23/552 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 43/02 (2013.01); H01L 23/13 (2013.01); H01L 23/552 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/49 (2013.01); H01L 27/222 (2013.01); H01L 23/49827 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92147 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1435 (2013.01); H01L 2924/1443 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Shielded semiconductor devices and methods for fabricating shielded semiconductor devices are provided. An exemplary magnetically shielded semiconductor device includes a substrate having a top surface and a bottom surface. An electromagnetic-field-susceptible semiconductor component is located on and/or in the substrate. The magnetically shielded semiconductor device includes a top magnetic shield located over the top surface of the substrate. Further, the magnetically shielded semiconductor device includes a bottom magnetic shield located under the bottom surface of the substrate. Also, the magnetically shielded semiconductor device includes a sidewall magnetic shield located between the top magnetic shield and the bottom magnetic shield.


Find Patent Forward Citations

Loading…