Agency for Science, Technology and Research

Globalfoundries Singapore Pte. Ltd.

Teck Guan Lim

Juan Boon Tan

Wanbing Yi

Danny Pak-Chum Shum

Shan Gao

Bhushan Bharat

Surya Bhattacharya

Hang Liu

Michael Han Kim Kwong

Eva Wai Leong Ching

Wei Yi Lim

Hideaki Fukuzawa

Various embodiments may provide a semiconductor package. The semiconductor package may include a substrate including a via hole. The semiconductor package may also include a chip attached to the substrate. The semiconductor package may further include a prefabricated ferromagnetic pin having a first portion held by the via hole, a second portion extending from a first end of the first portion, and a third portion extending from a second end of the first portion opposite the first end. The semiconductor package may also include a first magnetic shield structure attached to or extended from the second portion of the prefabricated ferromagnetic pin. The semiconductor package may further include a second magnetic shield structure attached to or extended from the third portion of the prefabricated ferromagnetic pin, such that at least a portion of the chip is between the first magnetic shield structure and the second magnetic shield structure.

Semiconductor package and method of forming the same

Various embodiments may provide an optical assembly. The optical assembly may include a substrate with a first and a second grooves, and a photonic integrated circuit chip with a coupling waveguide, a first and a second grooves. The optical assembly may further include a first and a second cylindrical rods held by the respective grooves of the substrate and the photonic integrated circuit chip. A portion of the first rod and a portion of the second rod define a vertical offset between the photonic integrated circuit chip and the substrate to align the coupling waveguide with an optical fiber.

Optical assembly and method of forming the same

Various embodiments may relate to a method of forming a photonic integrated circuit package (PIC). The method may include forming a redistribution layer (RDL) over a carrier. The method may also include forming a through hole or cavity on the redistribution layer. The method may additionally include providing a stop-ring structure, the stop-ring structure including a ring of suitable material, the stop-ring structure defining a hollow space, over the redistribution layer so that the hollow space is over the through hole or cavity. The method may further include arranging a photonic integrated circuit (PIC) die over the redistribution layer so that the photonic integrated circuit (PIC) die is on the stop-ring structure. The method may also include forming a molded package by forming a mold structure to at least partially cover the photonic integrated circuit (PIC) die to form the photonic integrated circuit package.

Photonic integrated circuit package and method of forming the same

Shielded semiconductor devices and methods for fabricating shielded semiconductor devices are provided. An exemplary magnetically shielded semiconductor device includes a substrate having a top surface and a bottom surface. An electromagnetic-field-susceptible semiconductor component is located on and/or in the substrate. The magnetically shielded semiconductor device includes a top magnetic shield located over the top surface of the substrate. Further, the magnetically shielded semiconductor device includes a bottom magnetic shield located under the bottom surface of the substrate. Also, the magnetically shielded semiconductor device includes a sidewall magnetic shield located between the top magnetic shield and the bottom magnetic shield.

Shielded magnetoresistive random access memory devices and methods for fabricating the same

Growing community of inventors

Singapore, Singapore

Teck Guan Lim