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For the Inventor, By the Inventor

Hwaseong, South Korea

Teakhoon Lee

This inventor holds 13 USPTO granted patents and 6 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2016-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teakhoon Lee. Retrieved from https://idiyas.com/inventor/teakhoon-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13 

% Patents Active = 100.0

Average Co-Inventor Count = 4.5

ph-index = 2

Forward Citations = 11(Granted Patents)


Location History:

  • Hwaseong-si, KR (2016 - 2024)
  • Suwon-si, KR (2023 - 2024)

Company Filing History:

goldMedal13 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2016-2025

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13 patents (USPTO):Explore Patents
1. 12355004 - Semiconductor chip and semiconductor package (2025-07-08),
2. 12237240 - Semiconductor package and method of manufacturing semiconductor package (2025-02-25),
3. 12218096 - Semiconductor package and method of forming the same (2025-02-04),
4. 12176313 - Semiconductor package (2024-12-24),
5. 11967581 - Package structures having underfills (2024-04-23),
6. 11923340 - Semiconductor package including mold layer and manufacturing method thereof (2024-03-05),
7. 11791308 - Semiconductor package (2023-10-17),
8. 11791282 - Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same (2023-10-17),
9. 11705323 - Wafer trimming device (2023-07-18),
10. 11587906 - Package structures having underfills (2023-02-21),
11. 11462462 - Semiconductor packages including a recessed conductive post (2022-10-04),
12. 11362062 - Semiconductor package (2022-06-14),
13. 9245787 - Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same (2016-01-26),

Title: Teakhoon Lee - Innovative Inventor from Hwaseong-si, KR

Introduction: Teakhoon Lee is a renowned inventor hailing from Hwaseong-si, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Teakhoon Lee's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles and cutting-edge solutions for renewable energy storage systems.

Career Highlights: Throughout his illustrious career, Teakhoon Lee has received numerous accolades for his innovative work, including the prestigious Inventor of the Year award in South Korea.

Collaborations: Teakhoon Lee has collaborated with leading research institutions and tech companies worldwide to further develop and implement his revolutionary inventions, fostering a culture of innovation and progress.

Conclusion: Teakhoon Lee's dedication to pushing the boundaries of technology and his passion for creating a sustainable future through innovation continue to inspire the next generation of inventors and engineers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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