The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2023
Filed:
Oct. 23, 2020
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jungseok Ahn, Seoul, KR;
Unbyoung Kang, Hwaseong-si, KR;
Chungsun Lee, Asan-si, KR;
Teakhoon Lee, Hwaseong-si, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/304 (2006.01); B24B 21/00 (2006.01); B28D 5/02 (2006.01); B26D 7/18 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02021 (2013.01); B24B 21/002 (2013.01); B26D 7/18 (2013.01); B28D 5/02 (2013.01); H01L 21/304 (2013.01); H01L 21/68 (2013.01);
Abstract
The wafer trimming device includes a chuck table configured to hold a target wafer via suction, thereby fixing the target wafer, a notch trimmer configured to trim a notch of the target wafer, and an edge trimmer configured to trim an edge of the target wafer. The notch trimmer includes a notch trimming blade configured to rotate about a rotation axis perpendicular to a circumferential surface of the target wafer. The edge trimmer includes an edge trimming blade configured to rotate about a rotation axis parallel to the circumferential surface of the target wafer.