This inventor holds 3 USPTO granted patents and 4 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2023-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023-2026
Title: Jungseok Ahn and Semiconductor Packaging Innovation.
Introduction
Jungseok Ahn is an inventor associated with Suwon-si, South Korea, and Samsung Electronics Co., Ltd. His recorded patent work concerns semiconductor packaging, a field focused on assembling and connecting chips for use in electronic devices.
Latest Patents
Ahn is listed as an inventor on one patent: “Semiconductor Package Including Stacked Chips and Method of Manufacturing the Semiconductor Package.” The invention addresses a semiconductor package containing stacked chips and a method for manufacturing that package. The available information does not establish when the patent was filed or granted.
Career Highlights
Ahn’s recorded patent contribution reflects work in semiconductor packaging, an area relevant to the integration of multiple chips into compact electronic systems. He is associated with Samsung Electronics Co., Ltd. 1 patent is listed for him in the provided data.
Collaborations
Ahn is listed alongside fellow inventor Seyong Lee on the semiconductor packaging patent. Their shared inventorship connects them to the disclosed package design and manufacturing method.
Conclusion
Jungseok Ahn’s recorded innovation centers on stacked-chip semiconductor packaging, developed in collaboration with Seyong Lee and associated with Samsung Electronics Co., Ltd.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile