The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2026
Filed:
Apr. 17, 2023
Applicant:
Samsung Electronics Co, Ltd., Suwon-si, KR;
Inventors:
Seyong Lee, Suwon-si, Gyeonggi-do, KR;
Jungseok Ahn, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., SUWON-SI, GYEONGGI-DO, KR;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...
H10W 90/00 ; H10W 72/90 ; H10P 72/7416 ; H10W 72/942 ; H10W 72/967 ; H10W 80/732 ; H10W 20/0245 ; H10W 90/732 ; H10W 72/823 ; H10W 72/987 ; H10W 74/15 ; H10W 72/073 ; H10W 72/851 ; H10W 72/923 ; H10W 72/944 ; H10W 72/952 ; H10W 80/721 ; H10W 90/26 ; H10W 20/20 ; H10W 72/9445 ; H10W 72/981 ; H10W 74/012 ; H10W 20/0249 ; H10W 72/20 ; H10W 72/242 ; H10W 99/00 ; H10W 90/297 ; H10W 90/724 ; H10W 72/29 ; H10P 72/74 ; H10W 72/926 ; H10W 80/743 ; H10W 72/30 ; H10P 72/7424 ; H10W 20/023 ; H10W 90/722 ; H10W 72/01 ; H10W 74/01 ; H10W 42/121 ;
Quick Actions:
Lee, Seyong. (2026). Semiconductor package including stacked chips and method of manufacturing the semiconductor package (U.S. Patent No. 12713985). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12713985
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