The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2024
Filed:
Aug. 18, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yeongkwon Ko, Hwaseong-si, KR;
Jinwoo Park, Seoul, KR;
Jaekyung Yoo, Seoul, KR;
Teakhoon Lee, Hwaseong-si, KR;
Abstract
A semiconductor package includes a package substrate on which a base chip is disposed. A first semiconductor chip is disposed on the base chip. A second semiconductor chip is disposed on the first semiconductor chip. An inner mold layer surrounds an upper surface of the base chip and respective side surfaces of the first semiconductor chip and the second semiconductor chip. A first outer mold layer is interposed between the package substrate and the base chip while covering at least a portion of a side surface of the base chip. A second outer mold layer is disposed on the first outer mold layer while covering at least a portion of a side surface of the inner mold layer. The second outer mold layer is spaced apart from the package substrate. The first outer mold layer and the second outer mold layer have different viscosities.