Te Tsung Chao

Title: Te Tsung Chao: Innovator in Semiconductor Technology

Introduction

Te Tsung Chao is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding three patents that enhance the efficiency and effectiveness of wire-bonding operations.

Latest Patents

One of his latest patents is a "Method of automatically identifying and skipping defective work pieces for wire-bonding operation." This innovative method utilizes a reject eye formed inside the die covering area on a substrate to automatically determine whether the skipping procedure should be triggered. The process involves aligning the die eye and lead eye, locating the reject eye, and stopping the wire bonding operation when necessary. This invention significantly reduces operating downtime and increases throughput.

Another important patent is the "Method for positioning bond pads in a semiconductor die." This method outlines a systematic approach to setting parameters for bond pad positioning, including determining angles and spacing increments. By optimizing the positions of bond pads, this method enhances the overall performance of semiconductor devices.

Career Highlights

Te Tsung Chao is currently employed at Advanced Semiconductor Engineering, Inc., where he applies his expertise in semiconductor technology. His work focuses on improving manufacturing processes and ensuring high-quality production standards.

Collaborations

He collaborates with talented coworkers, including Hui Chin Fang and Yung I Yeh, who contribute to the innovative environment at Advanced Semiconductor Engineering, Inc. Their teamwork fosters advancements in semiconductor technology.

Conclusion

Te Tsung Chao's contributions to semiconductor technology through his patents demonstrate his commitment to innovation and efficiency in the industry. His work continues to influence the field positively.