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For the Inventor, By the Inventor

Taipei, Taiwan

Te-Sheng Yang

This inventor holds 7 USPTO granted patents. Top assignee: United Microelectronics Corp.. Active years: 2000-2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Te-Sheng Yang. Retrieved from https://idiyas.com/inventor/te-sheng-yang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7

% Patents Active = 100.0

Average Co-Inventor Count = 1.9

ph-index = 5

Forward Citations = 217(Granted Patents)


Location History:

  • Taipei, TW (2000 - 2002)
  • Taiipei, TW (2003 - 2005)

Company Filing History:

goldMedal7 out of 7,278 
 
United Microelectronics Corp.
 patents

Years Active: 2000-2005

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7 patents (USPTO):Explore Patents
1. 6846697 - Integrated circuit packages and the method for making the same (2005-01-25),
2. 6545350 - Integrated circuit packages and the method for the same (2003-04-08),
3. 6399421 - Dual-dies packaging structure and packaging method (2002-06-04),
4. 6313527 - Dual-dies packaging structure and packaging method (2001-11-06),
5. 6291881 - Dual silicon chip package (2001-09-18),
6. 6204562 - Wafer-level chip scale package (2001-03-20),
7. 6043109 - Method of fabricating wafer-level package (2000-03-28),

Title: Te-Sheng Yang: Innovator in Integrated Circuit Packaging

Introduction

Te-Sheng Yang is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of integrated circuit packaging, holding a total of 7 patents. His innovative work focuses on improving the quality and efficiency of integrated circuits, which are essential components in modern electronics.

Latest Patents

One of Te-Sheng Yang's latest patents is titled "Integrated Circuit Packages and the Method for Making the Same." This invention relates to a method and means for packaging integrated circuits, particularly focusing on the integration of a heat sink within operating integrated circuit packages. The heat sink is bonded to the lead frame by a tap, utilizing the length between the heat sink and the first mold packaged materials to prevent voids that could disrupt thermal mold flow. This design not only enhances heat dissipation from the lead frame but also prevents delaminating and cracking in the chip, ultimately improving the quality of integrated circuits.

Career Highlights

Te-Sheng Yang is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work has been instrumental in advancing the technology behind integrated circuits, making them more reliable and efficient for various applications.

Collaborations

Throughout his career, Te-Sheng Yang has collaborated with notable colleagues, including Kai-Kuang Ho and Charlie Han. These partnerships have fostered innovation and contributed to the development of cutting-edge technologies in the field of integrated circuits.

Conclusion

Te-Sheng Yang's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing. Through his work, he continues to influence the future of electronics and integrated circuit technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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