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For the Inventor, By the Inventor

Setagaya, Japan

Tatsuo Enomoto

This inventor holds 10 USPTO granted patents. Top assignee: Shin-Etsu Handotai Co., Ltd.. Active years: 1993-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tatsuo Enomoto. Retrieved from https://idiyas.com/inventor/tatsuo-enomoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 100.0

Average Co-Inventor Count = 2.5

ph-index = 2

Forward Citations = 18(Granted Patents)


Location History:

  • Fukushima, JP (1993)
  • Annaka, JP (2011)
  • Tokyo, JP (2015)
  • Setagaya-ku, JP (2017 - 2023)

Company Filing History:

goldMedal10 out of 1,099 
 
Shin-Etsu Handotai Co., Ltd.
 patents

Years Active: 1993-2023

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10 patents (USPTO):Explore Patents
1. 11584037 - Wire saw apparatus and method for manufacturing wafer (2023-02-21),
2. 10730161 - Method for conditioning polishing pad and polishing apparatus (2020-08-04),
3. 10434621 - Workpiece processing apparatus and workpiece processing method (2019-10-08),
4. 10236191 - Wafer drying apparatus and method for drying a wafer (2019-03-19),
5. 10166649 - Machining apparatus for workpiece (2019-01-01),
6. 9931730 - Automatic handling apparatus with positioning pins (2018-04-03),
7. 9728442 - Workpiece holding apparatus (2017-08-08),
8. 9050698 - Manufacturing method of carrier for double-side polishing apparatus, carrier for double-side polishing apparatus, and double-side polishing method of wafer (2015-06-09),
9. 7902042 - Method of manufacturing SOI wafer and thus-manufactured SOI wafer (2011-03-08),
10. 5211794 - Wafer etching apparatus (1993-05-18),

Title: Innovations of Tatsuo Enomoto

Introduction

Tatsuo Enomoto is a prominent inventor based in Setagaya-ku, Japan. He has made significant contributions to the field of wafer manufacturing and polishing technologies. With a total of 10 patents to his name, Enomoto's work has had a substantial impact on the semiconductor industry.

Latest Patents

Among his latest innovations is a wire saw apparatus and method for manufacturing wafers. This apparatus includes a plurality of wire guides and a wire row that is designed to travel reciprocatively in an axial direction. It features a nozzle for supplying coolant or slurry, a workpiece-holding portion for suspending a workpiece plate, and a mechanism to adjust the parallelism of the wire guides. This invention allows for the manufacturing of wafers with various warp shapes by controlling the warp in the wire's traveling direction. Another notable patent is a method for conditioning polishing pads. This method involves moving a conditioning head in a radial direction while the polishing pad rotates, allowing for effective conditioning of the entire surface of the pad.

Career Highlights

Tatsuo Enomoto is currently employed at Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor materials sector. His work at this company has been instrumental in advancing wafer manufacturing techniques.

Collaborations

Enomoto has collaborated with notable colleagues such as Taichi Yasuda and Michito Sato. Their combined expertise has contributed to the development of innovative solutions in the field.

Conclusion

Tatsuo Enomoto's contributions to wafer manufacturing and polishing technologies highlight his role as a key innovator in the semiconductor industry. His patents reflect a commitment to advancing technology and improving manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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